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                    人才招聘
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                    芯片封裝專家

                    崗位描述: As a package designer you will be responsible for advanced package design and technology development as well as foundry management and vendor interfacing. You responsibilities include but not limited to: Design rule development and implementation of in-house packaging layout to meet product requirements. EDA tool set up and flow development. PISI analysis on full chip and critical IPs at package and board level. Define and develop package solution for high speed high power and large pin count device in a cross-function team Collaborate with foundry PE TE and QA teams on chip bring up and qualification. Interface with vendors on process optimization chip characterization and failure analysis for volume production Drive new technology development such as multi-die hybrid-bonding advanced substrate design for manufacturability and design for reliability as a collaborative effort with vendors 

                    崗位要求: Masters degree andor PhD in Electrical Engineering or related fields with 5 years of experience. Hands on experiences the following: Cadence Allegro APD SiP tools Sigrity XtractIM PowerSI Hands on experiences with layout of FCBGA MCM SiP WLBGA etc and optimization for ball count and power grid. Experience on design of very large form factor flip chip package with high substrate layer count Experience on 2.5D or 3D multi-die solutions such as Info CoWoS SoIC or chiplet. Experience with high-speed IO interfaces design and bringup such as DDR PCIe and HBM is preferred. Experience on mechanical and thermal analysis and control knowledge on mechanical and thermal reliability is a must. Understanding of voltage regulator design and power distribution is a plus. Capability of driving package roadmap to meet future products on advanced nodes.


                    測試工程師

                    崗位職責: 

                    1、精通WiFi 802.11相關協議要求,負責2.4GHz5GHz的功放芯片設計、仿真、驗證、配合調試及問題定位工作; 

                    2、配合完成版圖設計及投片工作; 

                    3、完成設計文檔及流片評審。 

                    任職資格: 

                    1、職業素質:熟練掌握射頻微波基礎知識,熟悉并理解GaAs、CMOS等工藝流程;熟練運用ADS、AWR、Cadence、HFSS等仿真軟件; 

                    2、專業素質:電磁場與微波技術、無線電物理或者相關專業碩士學歷,具備熟悉英文讀寫能力。 

                    3、工作經驗:碩士2年及以上射頻類產品開發經驗(本科5年工作經驗者也可考慮)。

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